Vapor Phase Reflow Soldering
Vapor phase reflow refers to an advanced PCB soldering technology that uses an inert liquid with a high boiling point. Vapor phase reflow soldering ensures that the PCB board and its members don’t face temperatures higher than necessary. For that reason, parts don’t overheat.
Why Use Vapor Phase Reflow?
To solder electronic components to PCBs, manufacturers usually need to use high temperatures. It’s a complex process that has become even more challenging as electronic components become smaller.
The vast majority of manufacturers now opt for leadless solder bases. These bases require even higher temperatures to melt the solder effectively. As a result, the risk of damage to the electronic units due to overheating is higher.
Vapor phase reflow technology helps counter this problem by virtually eliminating temperature fluctuations, topography, and board layout.
Benefits of Vapor Phase Reflow
Vapor Phase Reflow produces quality solder joints for difficult parts and allows for precise temperature control. It maintains consistent actual temperature, regardless of the size, shape or surface area of the PCB. Every component will likewise maintain the identical temperature, regardless of its size, density or location.